Point of contact with the X-ray tube, Mo/Rh/W/Ag (optional), 50 kVp, 1 MAC detection system, Si-Pin diode (optional: SDD, FSDD)Energy resolution of the SI-Pin diode: 149 eV at half-height at Mn Ka / Option: SDD (125 eV), FSDD (122 eV)Collimator Collimator 0.3 (optional: 0,05, 0,1, 0,2, 0,3, 1 mm) Manual/ automatic stage change Detection element I (22) ~ U (92)Sample type Multi-layer wide printed circuit board Displacement distance 200 mm X 250 mm X 14 mm / 500 mm X 500 mm X 14 mm Scene size 473 mm X 525 mm / 520 mm X 520 mm Key Features Automatic/manual scene mode Coating thickness measurement: General, Rh, Pd, Au, Ag, Sn, Ni Measuring the thickness of multilayer thin films (up to 5 layers) Magnification of the camera 40~80xsafety 3-point blocking of the reportExcel, PDF / output Custom Form Key advantages Measuring the thickness of multilayer thin films (up to 5 layers) Convenient stage management Multipoint measurement is possible RoHS screening (optional) Remote support via the Internet Application verification of products for compliance with international environmental standards (compliance with RoHS, WEEE, ELV) Hazardous materials (Cr, Br, Cd, Hg, Pb, Cl, Sb, Sn, S) Sorting equipment Coating analysis of automotive parts, Electronic circuit board (PCB), for example, capacitor Analysis of single-layer, multi-layer, alloyed coating The thickness with the composition ratio can be measured over time in the metallization of the alloy
